The 40W UV picosecond laser (wavelength 355nm) combines the advantages of UV short wavelength and picosecond ultrafast pulses (10^-12 seconds), offering high-precision cold processing capabilities.Its features include: High photon energy: ultraviolet light is easily absorbed by most materials, making it suitable for processing high-reflectivity or transparent materials especially; Low thermal impact: picosecond pulses enable micron-level processing with almost no thermal diffusion; High beam quality: small focused spot (up to micron-level), suitable for ultra-precision processing.
The 355nm UV wavelength can be absorbed by most materials efficiently.(especially polymers, glass, semiconductors, etc.), enabling ultra-fine processing at the submicron level and breaking through the precision limits of conventional lasers.
The heat-affected zone is almost negligible, and the degree of thermal impact during processing is minimal, allowing the material's original properties to be maintained.
With beam quality of M² < 1.1, high-precision cutting can be achieved, ensuring the quality and accuracy of the cut edges.
