From August 26 to 28,2025,the second session of the TGV industrial chain summit forum was successfully concluded in Shenzhen baoan international convention and exhibition center.Huachuang Hongdu with the TGV complete solution appeared in the forum,and achieved a complete success.
This exhibition brings together the top enterprises, authoritative experts and scholars from all over the country,focusing on the glass substrate TGV technology breakthrough,equipment innovation,industry chain synergy and other key issues.As a domestic ultra-fast laser manufacturer,Huachuang Hongdu has attracted many experts,customers and partners in the TGV technology industry to consult and pay close attention to the excellent performance and reliability of its products.
This femtosecond laser,which is specially designed for TGV machining,is unique in that it realizes highly stable”in vivo modification”precision cold machining.Thanks to the extremely stable femtosecond pulse output of energy and width,each pulse can deposit energy into a very small focal volume of glass with high precision and repeatability through multiphoton absorption effect,achieving sub-micron level controllable modification.At the same time,it is high efficiency and high precision,the drilled pore depth and wide ratio is high,the pore quality is uniform and the consistency is good,and the substrate of many materials can be effectively treated.This not only greatly improves the yield and reliability of the TGV process,but also provides a key enabling technology for advanced packaging and three-dimensional processing of micro-nano devices.
The successful hosting of this summit not only provides a high-quality exchange platform for upstream and downstream enterprises in the TGV industry chain,but also fully demonstrates China’s innovation vitality and technological strength in the field of advanced semiconductor packaging.Huachuang Hongdu will continue to uphold the concept of”Empowering millions of industries with laser technology,”and work with industry partners to promote the industrial application of TGV technology,jointly helping China’s semiconductor packaging technology to reach a new peak.We look forward to gathering again at the next event to create a new future for the industry!
