The 120W green picosecond laser (wavelength 532nm) utilizes high-power picosecond pulse technology (pulse width ~10ps), combining high average power (120W) and short wavelength characteristics, making it particularly advantageous in precision machining. Its high photon energy and low thermal impact make it especially suitable for ultra-fine processing of highly reflective metals and photosensitive materials.It can achieve micrometer-level cutting/drilling with no molten slag on the edges (such as with high-reflective materials like copper and aluminum); supports cold processing of brittle materials (like glass and ceramics) to avoid cracks; and surface treatments (structuring, marking) exhibit high contrast with no thermal damage.
The maximum power can reach 120W, achieving a technological breakthrough in higher power and higher stability, which can significantly improve production speed.
Excellent pointing stability and spot uniformity make this product capable of meeting the high technical requirements of DOE shaping and processing.
Supports programmable Burst Mode functionality, allowing users to customize the number of pulses, intervals, and energy distribution within the pulse train, enabling more precise control over the energy deposition process.
Backside membrane grooving: precisely etch AlOx/SiNx stacks to avoid damaging the silicon substrate and improve photoelectric conversion efficiency.
Laser doping (SE): Selectively ablate phosphosilicate glass (PSG) to achieve localized re-doping and reduce contact resistance.
Patterning of transparent conductive films (TCO): Etching ITO/FTO lines without microcracks (traditional nanosecond lasers easily cause thermal damage)
