The laser source Meets the requirements for high-precision applications such as cutting, drilling, and through-hole machining of glass, sapphire, and special materials, with a small heat-affected zone and stable processing quality, suitable for various industries including consumer electronics and high-end manufacturing.The infrared ultrafast laser system features an average power of up to 300W and a single pulse energy of 3.5mJ, combined with excellent beam quality (M² < 1.3) and flexible control interfaces (RS232, GATE, TRIG, supporting PSO function), ensuring both processing efficiency and system stability when performing complex processes such as cutting thick glass (>19mm). The modular structure design facilitates integration and maintenance, making it suitable for mass continuous production environments.
